摘要
在分析3G网络下单晶片智能卡芯片操作系统(COS)的结构及关键技术基础上,提出绑定式多晶片智能卡COS的覆盖模型,对模型各功能模块结构及构造流程进行研究。通过对模型的裁剪,抽象出符合用户需求的绑定式单晶片智能卡COS模型,并对模型进行可行性分析及评估。
Based on the analysis of the structure and the key technologies of smart card MiniCOS on 3G network, a cover model of smart card Bind Max COS is proposed, the structure and the construction process of this model are studies. A smart card Bind_Mini_COS which suits for the customs taste is made. And a feasibility analysis and evaluation for this model are described.
出处
《计算机工程》
CAS
CSCD
北大核心
2010年第6期256-258,共3页
Computer Engineering
基金
广州市越秀区自然科学基金资助项目"绑定式近场通信3GCOS研制"(2008-GX-015)
