电子器件环氧塑封料在湿热环境下的老化行为

Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

针对电子器件在服役过程中的环氧塑封料老化失效问题,探讨了60℃下,环氧塑封料分别在干燥、湿热(95%和98%相对湿度)条件下的老化行为,并试验对比了这两种条件下环氧塑封料的质量、硬度、力学性能和结构随老化时间的变化规律。结果表明,干燥和不同湿热条件导致了环氧塑封料的老化,其内部结构变化又影响到环氧塑封料的相对硬度值、失重率和弯曲强度。随老化时间增长,在98%相对湿度下,环氧塑封料的相对硬度值由5.62增加到12.01;在干燥条件下的失重率由0.008%增加至0.172%,而在湿热环境下的失重率则变化不大;环氧塑封料的弯曲强度在干燥环境下呈线性增加的趋势,而在湿热环境下呈现出先减后增的变化规律。

In order to analyze the failure problems of the epoxy molding compound（EMC）used for electronic components during application process, the aging behavior of EMC under drying and hydrotherrnal conditions （relative humidity 95% and 98℃ at 60℃ was studied. The relationship between aging time and the properties, such as the quality, hardness, mechanical properties and structure of EMC were also discussed. The results show that the aging process of EMC would be accelerated under drying and hydrothermal conditions. The quality, hardness and bending strength of EMC changed with its structure. With increasing the aging time in different conditions, the relative hardness increased from 5. 62 to 12. 01 in the hydrothermal condition （98% relative humidity）. The weightloss ratio was enhanced from 0. 008% to 0. 172% in the dry condition, while in the hydrothermal condition it was almost stable. The bending strength increased linearly with time in the dry condition, and increased at first then declined in the hydrothermal condition.