航空用银铝多元合金钎料钎焊性能的研究

Study on Performance of BAgAl Solder Used for Avigation

对自行设计加工的BAgAl合金钎料的熔化特性进行了研究,并对其润湿铺展及漫流性做了相应的试验。用该钎料真空钎焊TC4/TC4,通过金相显微镜,扫描电镜及EDS观察分析,结果表明,该钎料性能优良,在Ti及Ti合金基体上的流动性和润湿性好,钎缝圆角适中,表面光洁致密。微观分析表明,Ag和Al能够扩散到基体金属中,在钎焊界面处形成有一定的塑性的金属间化合物(Ag-Al-Ti),而钎料中的扩散层厚度随温度升高、时间延长而增加,铝可以有效抑制钛合金的溶解。

The melting characteristic of self-designed BAgAl alloy was studied and vacuum brazing experiment was made on TC4 alloy. Through analysis of metallographic microscopy, scanning electron microscopy and EDS, it .shows that BAgAl solders have good performance, wettability and liquidity on Ti and Ti alloy, as well as moderate brazing seam fillet and smooth dense surface. The micro-analysis results show that Ag and Al can diffuse in based metal and form intermetallic compound （Ag-Al-Ti） with plasticity. The thickness of diffusion layer increase with temperature increasing and time expanding in solder. The Al can effectively inhibit the solution of Ti alloy.