低黏度环氧树脂固化度唯象模型及其在实际工程中的应用

A Phenomenological Model for Predicting the Degree of Cure of a Low Viscosity Epoxy Resin System and Its Application in Engineering

采用等温和非等温差示扫描量热(DSC)对Huntsman1564/3486低黏度环氧树脂体系的固化反应进行了研究,建立了修正的Olivier固化度唯象模型,用于描述恒温条件下固化度温度时间关系。模型计算值与实验值符合良好。监测了基于实际工程应用背景85mm厚复合材料单面模具加热固化过程中制件厚度方向的温度情况,针对该过程提出了基于修正Olivier模型的适用于变温条件的时间离散分步计算法,并计算了固化过程厚度方向的固化度分布。

The curing reaction of the low viscosity Huntsman 1564/3486 epoxy resin system was studied by differential scanning calorimetry（DSC）technique under isothermal and dynamic curing conditions.The modified Olivier＇s phenomenological model was established to predict the relationship between the degree of cure and the couple of time and temperature.The model was verified by the experimental date.A GFRP laminates with thickness of 85 mm used in the engineering were cured by one-side rigid mould heating,and the temperature curves at different thickness position during curing were measured.The method of accumulation by time dispersing steps was proposed,and it＇s used to calculate the degree of cure curves based on the temperature curves at different thickness position.