黑瓷封装工艺研究

Research the Black Ceramic Packaging Process

伴随着微电子封装行业的迅猛发展,一批新兴的封装方式涌现出来,但黑瓷封装依靠不可替代的特性依然在军、民品封装中具有广阔市场,因此对其封装工艺进行研究有着重要的意义。根据对黑瓷封装特性的研究,设计出了满足黑瓷封装特性的工艺温度曲线,通过封盖试验,找出各相关因素(氮气,温度,加热时间)对黑瓷封装效果的影响。

With rapid developing of microelectronic package industry, many new packaging modes are emerging. However, black ceramic package is still of abroad market in military products and general products. Therefore, researching its packaging process is necessary. Basing on black ceramic packaging characters,we design process temperature curve . that it meet black ceramic packaging characters. By sealing lid test ,we find out effect in sealing about nitrogen、temperature、heating time