铜离子选择性电极法研究腐殖酸与铜离子络合的影响因素

Study on Influencing Factors of Dissolved Humic Acid and Cu^(2+) Metal Ions by Copper Ion-Selective Electrode

采用铜离子选择电极法在不同pH值、离子强度、铜离子浓度条件下测定水样中溶解态腐殖酸与铜离子的络合率,探讨主要因素对络合作用的影响。研究结果表明:随着pH的增大,腐殖酸对Cu2+的络合量总体增大,在实验条件下,络合率可超过94%。溶液中铜离子浓度的增加也会使络合率呈现上升趋势,而溶液中离子强度的增加反而使络合量减少。

This article used copper ion - selective electrode method to research complex percentage of dissolved humic acid and Cu^2＋ metal ions by a change of the influencing factors such as pH, ionic strength and copper ionic concentration. It studied the main influence factors on the complexation. The result indicated that with the increasing of pH value, the complexation capacity was increased generally. And the complex percentage is more than 94% under the experimental conditions. With the increasing of copper ionic concentration, the percent chelation was increased. However, along with ionic strength increasing, the complexation capacity was decreased.