SiC_P/Cu梯度复合材料的制备及性能研究

Study on Preparation and Properties of SiC_P/Cu Functionally Graded Materials

采用粉末冶金方法制备了SiCP/Cu均质复合材料及梯度复合材料,并对复合材料的显微组织、硬度、导电率和耐磨性进行了研究。结果表明:均质复合材料中SiC颗粒含量越多,导电率越小,耐磨性越好;梯度复合材料基体连续,组织及硬度呈梯度分布且其耐磨性优于基体Cu材料;磨损机理是微切削磨损和磨粒磨损的复合作用。

SiCP /Cu functionally graded materials were fabricated by powder metallurgy.The microstructure,microhardness,conductivity and wear resistance were researched.The results show that,the matrix of the gradient compound material is continuous,microhardness and microstructure of the composites take on gradient distribution.The conductivity and wear resistance become less and better,respectively,with the increase of SiC content.The wear resistance of SiCP /Cu functionally graded materials are more superior to that of Cu based material,and its wearing mechanism is the combined action between micro-cutting wearing and grain wearing.