非甲醛化学镀铜研究进展

Research progress of non-formaldehyde electroless copper plating

化学镀铜在PCB生产中应用广泛,但常用的还原剂甲醛对人体和环境有害。本文综述了化学镀铜中替代甲醛的环保型还原剂的研究进展,介绍了以醛糖类、含硼化合物、低价金属盐、次磷酸盐作还原剂的化学镀铜研究现状及进展。

Electroless copper plating is widely used in PCB manufacturing, but the commonly-used reducing agent formaldehyde is harmful to people and environment. The research progress of the environmentally friendly reducing agents as alternatives to formaldehyde for electroless copper plating, such as aldoses, boron containing compounds, protosalts, and hypophosphite, were introduced in details.