01005表面组装工艺分析

Analysis of the Technology of Q1005 Surface Mounting

在SMT领域，随着元件体积向越来越小，功能密度向越来越高的方向发展，制造者和用户必须越来越协同合作以开发出适用的，经济划算的解决方案；针对01005的实施会给SMT领域相关的产品，工艺和设备带来新的挑战，本文将对这些进行论述。

With the components tend to become more and more small and function density more and more higher in the SMT field, both the manufactures and users must co-operate to develop more suitable and economic proposal. This paper will meet the challenge that Q1005 will bring in the technology and equipment in the field of SMT.