电瓷瓷套经三种方法机加工后的残余应力变化

Residual Stress Variation of Insulator Cylinder Machined by Three Kinds of Methods

通过X射线衍射仪分析了一种高强度电瓷瓷套分别经金刚石锯片切割、金刚石砂轮磨削和油石抛光三种不同方法机加工后的残余应力。结果表明:机加工后电瓷瓷套表面残余应力相对较小,且均为拉应力;磨削过程产生的残余应力最大,而抛光可以有效降低电瓷瓷套表面残余应力;由于电瓷瓷套表面因为机加工产生的残余应力值往往达到其断裂强度的30%～50%,所以常会导致电瓷瓷套表面出现裂纹、崩边或豁口。

Residual stress of a high strength insulator cylinder machined by three kinds of methods including diamond-blade incising, diamond-wheel grinding and whetstone polishing was analyzed by using X-ray diffraction. The results show that the residual stress on the insulator cylinder surface was relatively small after machining and was tensile stress. The maximal residual stress generated during the grinding, and the polishing could decrease the stress effectively. The residual stress on the insulator cylinder surface after machining could reach 30%- 50% of the rupture strength, which would result in crack, brokenedge or nick on the insulator cylinder surface.