压制过程中PBX炸药颗粒的破碎及损伤

Crack and Damage of PBX during Pressing

用扫描电镜及激光粒度仪研究了PBX炸药在不同压制条件下的微观结构变化及粒度分布。结果表明,随着成型试件密度的增加,晶体的破碎、损伤情况加重;成型试件中HM X的平均粒径随着压力的增加而减小(压制前的33.05μm到250M Pa压制后的16.92μm);在相同压力条件下,热压(70℃)制品的密度更高,但晶体的破碎却更小,热压(70℃)制品中HM X的平均粒径要大于冷压(25℃)制品中HM X的平均粒径。

The cracking and damage of polymer bonded explosives （PBX） based on HMX pressed under 50- 250MPa were investigated by SEM. The particle size distributions of HMX were measured by a laser particle size analyzer. Results show that as the porosity in samples reduces, the crystal twinning and cracking in pressed PBX increases obviously. The mean particle diameters of HMX are changed from 33.04μm before pressing to 16.92μm under 250MPa pressing. Under the condition of same pressure, the densities of shaping samples pressed at 70℃ are higher than those of samples pressed at 25 ℃, but the HMX cracking decrease and the mean particle diameters of HMX pressed at 70℃ are larger than those of samples Pressed at 25℃.