摘要
设计针对于PCB板的铜膜厚度进行测量。利用电磁感应的原理,以高频反射式电涡流传感器为基础,将LC电路产生的正弦电磁波辐射至铜膜。在铜膜上产生电涡流,从而引起辐射线圈电阻抗的变化,损耗增加,振荡信号幅值随之衰落。通过单片机对信号幅值进行A/D转换,数据处理,指示铜膜的厚度。所设计的装置体积小,携带方便,对铜膜检测的灵敏度较高,可以有效测量10～150μm的厚度,也可应用于其他金属镀层厚度的测量。
A device was designed to measure the thickness of copper film on PCB board.Based on the high frequency reflexible eddy current sensor,with the priciple of electromagnetic induction,the sine electromagnetic wave produced by LC oscillator is transmitted to the copper film on PCB board,and then the eddy current is generated on the copper film,thus the impedanced of the coil is changed,the loss is increased and the amplitude of LC oscillating signal is faded.The thickness of the copper film is displayed after A/D conversion of the signal amplitude and data processing by a single chip computer.This device is stable,small and portable,and has an efficient range in 10~150 μm.It also can measure the thickness of other metal.
出处
《现代电子技术》
2010年第7期179-182,共4页
Modern Electronics Technique
基金
2008年浙江省大学生科研创新团队资助项目
关键词
电涡流
铜膜厚度
幅度
电磁感应
eddy current
thickness of copper film
amplitude
electromagnetic induction
