泡显影液法T-TOP剥离工艺研究

The Research of T-TOP Lift-off Process by Soaking Wafer in Developer

介绍的泡显影液法T-TOP剥离工艺,是一种简单的金属剥离方式,它在普通光刻工艺流程中加入浸泡显影液环节,通过调节烘烤温度,制作出利于剥离的T型胶剖面,并配合正确的剥离操作,最终实现完好的金属互联。该方法相对来说,工艺简单、易于操作、经济实用。

This paper describes a T-TOP lift-off process by soaking wafer in the developer which is a simple way of metal lift-off, only one more step of soaking than general lithography process. By optimizing the bake temperature,and obtaining the T type PR profile, as well as operating correctly when lifting-off ,we can realize perfect metal connecting. This simple process can be easily operated and does not cost too much.