电镀工艺对多层瓷介电容器介电性能的影响

The effect of plating on the properties of MLCC

用滚镀和静态电镀的实验方法研究了电镀过程对多层瓷介电容器（ＭＬＣＣ）的介电性能的影响。镀镍后，ＭＬＣＣ的电容量略有提高，损耗和温度系数几乎没有变化。镀锡后，ＭＬＣＣ的电容量下降幅度较大，损耗增大，并且随着温度的升高而迅速增加，从而导致电容量变大，进而使电容量温度系数增大。并且高温损耗随着测试频率的提高而降低。将ＭＬＣＣ置于正在电镀的镀镍液和镀锡液中浸泡，发现镀锡液较镀镍液对ＭＬＣＣ有更强的渗入能力和侵蚀能力。

The effect of plating on the properties of MLCC is investigated When Ni plated, capacitance increases slightly, and DF and TC almost remain the same When Sn plated, capacitance decreases in large degree, DF increases and goes up rapidly while temperature raises;therefore, TC increases, and at high temperature, DF reduces while the test frequency increases Sn plating solution is stronger than Ni plating solution in penetration and corrosion (1 ref )