摘要
多芯片组件的测试分三类：基板、ＩＣ裸芯片和组件测试。各类测试都有若干种不同的测试方法，如多层基板的电学测试法，光学测试法；ＩＣ裸芯片的内建自测试法，界面扫描法；组件的全功能测试法，有限功能测试法等。本文对这些方法的优点与不足处，测试设备使用时应注意的事项，适用对象等作了详尽的介绍，还对各种类似方法的功能作了比较。
Tests of multichip modules (MCM) include test of substrates, test of bare dies and test of modules Of them, each adopts deferent methods, such as electric and optical test methods for substrates, self test method and scanning methods for bare dies, full function and limited function test methods for modules Of each method, the advantages and disadvantages, usages and important points for operating test instruments are represented and compared (29 refs )
出处
《电子元件与材料》
CAS
CSCD
1998年第6期23-28,共6页
Electronic Components And Materials
