摘要
焊球是BGA及μBGA等高密度封装技术中凸点制作关键材料。焊球直径是影响焊球真球度及表面质量的关键因素。采用切丝重熔法制作焊球,研究了焊球直径对Sn63Pb37焊球真球度和外观质量影响。结果表明:当预热温度为500℃,球化温度为300℃时,焊球真球度随着焊球直径增大而增大,表面质量随着焊球直径增大而下降。
A solder ball is the key material of the bump fabrication in the BGA and μBGA high density package. The diameter of the solder ball is a main factor to affect the quality of the solder ball. The solder ball is fabricated by the fine wire cut - remelted method. The influences of diameter of solder ball on the real sphericity and the surface appearance of the solder ball are investigated. Results show that the sphericity and the surface appearance of the solder ball became better with the reduce of the spherule diameter when the spheroidized temperature and the preheating temperature are repectively 500 is 500 ℃ and 300 ℃. But the real sphericity of the solder ball becomes smaller and the surface quality becomes poorer with the increasing of the diameter of solder balls.
出处
《电子工艺技术》
2010年第2期81-83,共3页
Electronics Process Technology
基金
河南省高等学校青年骨干教师资助计划项目(项目编号:09003046)
洛阳市科技攻关项目(项目编号:0801038A)
