PI表面改性对PANI/PI复合膜性能的影响

Effect of Polyamide Surface Modification on Propertie of Polyaniline/Polyamide Compound Films

采用分散聚合体系,在聚酰亚胺(PI)薄膜表面原位沉积聚苯胺(PANI)制得高导电性PANI/PI复合膜。用不同物理、化学方法对PI薄膜表面进行改性。结果表明,通过等离子体处理、超声波处理以及不同溶液浸泡处理的PI基体均改善了复合膜表面质量,提高复合膜电导率,其中过硫酸胺(APS)水溶液处理制得复合膜的电导率相对最高。紫外光谱和红外光谱分析证实基体表面为质子酸掺杂的PANI膜层,膜中不含有空间稳定剂聚乙烯吡咯烷酮。

Polyaniline/polyamide （PANI/PI） compound films with a high conductivity were prepared through an in-situ depositon on PI matrix in a dispersion polymerization system. The surface of PI films was modified by different physical and chemic methods. The results show that the surface quality of compound films can be improved, and the conductivity of compound films can be significantly increased when PI matrix is treated by plasma, ultra- sonic wave or different dipping solution. The conductivity of eompound films pretreated by APS solution is relatively the highest. UV and IR spectrum confirm that matrix surface is only eomposed of proton acid-doped PANI surfaee without space stabilizer PVP.