摘要
使用射频等离子,通过等离子表面聚合技术对环氧树脂模塑料用硅微粉进行改性,考察了放电功率、处理压力、处理时间对硅微粉表面处理效果的影响。用于硅微粉表面等离子聚合包覆的单体有吡咯、1,3-二胺基丙烷、丙烯酸、尿素,包覆后硅微粉用红外光谱和接触角来表征。使用等离子包覆后的硅微粉制备了大规模集成电路封装用环氧树脂模塑料(EMC)。结果表明,硅微粉表面能够被吡咯、1,3-二胺基丙烷、丙烯酸、尿素包覆。利用等离子改性后的硅微粉制备的EMC性能被提高。
Silica for epoxy molding compound （EMC） was modified by plasma surface polymerization using RF plasma, and the effects of plasma power, gas pressure and treat- ment time on surface treatment effects of silica were investigated systematically. The mono- mers utilized for the plasma polymer coatings were pyrrole, 1,3-diaminopropane, acrylic acid and urea. The plasma polymerization coating of silica was characterized by FTIR, contact angle. Using the silica treated by plasma as filler, the EMC used for the packaging of largescale integrated circuits was prepared. The results show that the surface of silica can be coa- ted by plasma polymerization of pyrrole, 1,3-diaminopropane, acrylic acid and urea, and the comprehensive properties of EMC are improved.
出处
《现代塑料加工应用》
CAS
北大核心
2010年第1期53-56,共4页
Modern Plastics Processing and Applications
基金
国家电子信息发展基金资助项目(292-2007)
关键词
硅微粉
等离子聚合改性
大规模集成电路封装
环氧树脂
模塑料
silica micropowder
plasma polymerization modification
large-scale integrated circuit packaging
epoxy
molding compound
