基于ANSYS/LS-DYNA的微流控芯片模内动力学特性研究

The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys/ls-Dyna

以有限元法的系统动力学理论为基础,采用显式ANSYS/LS—DYNA有限元分析软件对微流控芯片模内键合模具模内运动元件进行了模拟仿真计算,并对计算结果进行分析.以计算结果为依据,对模具的结构进行改进,优化其结构,改善受力状况.研究结果表明:模内元件最大应力值均在各元件材料屈服极限范围内;关键结点位移对模腔对准精度产生一定影响.研究结果为模内装配模具(IMA)结构设计开发提供了理论依据,对深入研究模芯制动与模具疲劳寿命间关系及提高模具寿命提供了理论.

With the finite elements model based on system dynamical theory and with the help of ANSYS/LS-DYNA,the research simulates the in-mold dynamics for microfluidic chips.Based on the results of the simulation,the research shows that：the maximum Von mises stress is below the materials summit limits;the key points displacements have certain impact on the alignment precision of the mold cavities.The research provides the theory for the in-mold assemble（IMA） technology.