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Ti/WSi/Ni ohmic contact to n-type SiCN

Ti/WSi/Ni ohmic contact to n-type SiCN
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摘要 Ti/WSi/Ni contact to n-type SiCN was investigated using the circular transmission line method. Current-voltage characteristics, X-ray diffraction and X-ray photoelectron spectroscopy were used to characterize the contacts before and after annealing. It is shown that the conducting behavior of the contacts is dependent on the annealing temperature. After annealing at 900℃ or above, ohmic contacts with specific contact resistivity were achieved. The 1000-℃-annealed contact exhibits the lowest specific contact of 3.07 × 10^-5 Ω·cm^2. The formation of ohmic contact with low specific contact resistivity was discussed. Ti/WSi/Ni contact to n-type SiCN was investigated using the circular transmission line method. Current-voltage characteristics, X-ray diffraction and X-ray photoelectron spectroscopy were used to characterize the contacts before and after annealing. It is shown that the conducting behavior of the contacts is dependent on the annealing temperature. After annealing at 900℃ or above, ohmic contacts with specific contact resistivity were achieved. The 1000-℃-annealed contact exhibits the lowest specific contact of 3.07 × 10^-5 Ω·cm^2. The formation of ohmic contact with low specific contact resistivity was discussed.
机构地区 Department of Physics
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2010年第4期14-16,共3页 半导体学报(英文版)
基金 supported by the National Natural Science Foundation of China(No.60606004).
关键词 SICN ohmic contact electrical property SiCN ohmic contact electrical property
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参考文献17

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