Cu-Ni-Si合金冷变形及动态再结晶行为研究

Study on cold deformation and dynamic recrystallization behavior of Cu-Ni-Si alloy

研究了时效温度和时效时间对不同冷变形条件下Cu-2.0Ni-0.5Si合金性能的影响。在Gleeble-1500D热模拟试验机上,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si合金在高温压缩变形中的流变应力行为进行了研究。结果表明,合金经900℃固溶,当变形量为40%,时效温度达到450℃时,其显微硬度达到201HV,导电率达到34%IACS。随变形温度升高,合金的流变应力下降,随应变速率提高,流变应力增大。在应变温度为700、800℃时,合金热压缩变形流变应力出现了明显的峰值应力,表现为连续动态再结晶特征。从流变应力、应变速率和温度的相关性,得出了该合金高温热压缩变形时的变形激活能Q。

The effect of aging temperature and aging time on microstructure and properties of Cu-2.0Ni-0.5Si alloy after various deformations were studied.The flow stress behavior of Cu-2.0Ni-0.5Si alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator.The results show that the hardness and electrical conductivity reach 201HV and 34%IACS respectively after the alloy with 40% cold deformation and then aged at 450℃ after the alloy soluted at 900℃.The flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.When the deformation temperature is 700 and 800℃,the flow stress decreases after a peak value,showing continuous dynamic recrystallization.The hot deformation activation energy Q was derived from the correlativity of flow stress,strain rate and temperature.