期刊文献+

一种FIB刻蚀结合KOH腐蚀的制造纳米梁的新方法

One new method to fabricate nanobeams using focused Ion beam (FIB) and KOH etching
原文传递
导出
摘要 常规的通过干法刻蚀制作纳米梁的方法会不可避免地在梁上引入晶格损伤层。本文提出一种制造无晶格损伤层纳米梁的新工艺方法。在常规光刻后,辅助利用FIB(聚焦离子束)刻蚀修改硅梁中部上方的SiO2掩模。根据单晶硅的材料和工艺特点,通过KOH各向异性腐蚀,硅梁两侧壁与硅片表面垂直,并自停止为(111)面。自停止面自校正地沿<112>晶向自硅梁中部向两端扩展,直至硅梁成型。经过冷冻干燥,最终在(110)SOI硅片上制得了宽度为112nm的单晶硅纳米梁。自校正的腐蚀方式提升了工艺稳定性,并且由于结合利用了湿法腐蚀和FIB技术,此工艺方法具有无晶格损伤层、工艺重复性好、加工精度高等优点。 Conventional method to fabricate nanobeams by dry etching will induce crystal damage inevitably. A new process method is proposed to fabricate nanobeams without surface damage layer. SiO2 masks above the middle of silicon beams are modified by Focused ion beam (FIB) after conventional photolithography. After KOH etching, sidewalls with (111) terminations are all vertical to (110) surface plane, based on the material and process properties of crystal silicon. ( 111 ) Terminations spread from the middle to the ends of beams along with the 〈 112 〉 direction by self-modifying etching, until beams are formed. After freeze drying, one silicon nanobeam with width 122nm is obtained on (110) Silicon- On- Insulator (SOI) substrate finally. Self- modifying etching improves the process repeatability. Besides, due to the combination of wet etching and FIB, this presented process method has some merits such as no surface damage, good repeatability, and high processing resolution.
出处 《功能材料与器件学报》 CAS CSCD 北大核心 2010年第2期163-168,共6页 Journal of Functional Materials and Devices
基金 自上而下的微纳制造原理与方法(编号:2006CB300403) 国家重点基础研究发展规划(973)项目:自上而下的微纳制造原理与方法(批准号:2006CB300403)资助
关键词 纳米梁 各向异性腐蚀 FIB nanobeam anisotropic etching FIB
  • 相关文献

参考文献21

  • 1A. Erbe, H. Kr? mmer, A. Kraus, et al. Mechanical mixing in nonlinear nanomechanical resonators [ J ]. Appl. Phys. Lett, 2000, 77:3102-3104.
  • 2K.L. Ekinci, X. M. H. Huang and M.L. Roukes. Ultrasensitive nanoelectromechanical mass detection [J]. Appl. Phys. Lett, 2004, 84:4469-4471.
  • 3D. Rugar, R. Budakian, H. J. Mamin, et al. Single spin detection by magnetic resonance force microscopy[ J]. Nature, 2004, 430:329-332.
  • 4K. Schwab, E. A. Henrikseu, J. M. Worlock, et al. Measurement of the quantum of thermal conductance [ J ]. Nature, 2000, 404 : 974 - 977.
  • 5H. J. Mamin, M. Poggio, C. L. Degen, et al. Nuclear magnetic resonance imaging with 90 -nm resolution [ J ]. Nature, 2000, 2:301 -306.
  • 6M. L. Roukes. Nanoelectromechanical systems face the future[J]. Phys. World, 2001, 14.
  • 7A. N. Cleland and M. L. Roukes. Fabrication of high frequency nanometer scale mechanical resonators from bulk Si crystals[ J]. Appl. Phys. Lett, 1996, 69:2653 -2655.
  • 8D. W. Carr, H. G. Craighead. Fabrication of nanoelectromechanical systems in single crystal silicon using silicon on insulator substrates and electron beam lithography [ J ]. J. Vacuum Sci. Technol, 1997, B 15: 2760-2763.
  • 9Kumar R. Virwani, A. P. Malshe, W. F. Schmidt, et al. Young's modulus measurements of silicon nanostructures using a scanning probe system: a non - destructive evaluation approach[J]. Smart Mater. Struct, 2003, 12:1028 - 1032.
  • 10N. Nelson - Fitzpatrick, K. Westra, P. Li, et al. Fabrication of nanoelectromechanical resonators using a cryogenic etching technique[J]. J. Vacuum Sci. Technol, 2006, B 24 : 2769 - 2771.

二级参考文献8

  • 1张建辉,李伟东,万红,吴学忠.TMAH腐蚀液制作硅微结构的研究[J].传感技术学报,2006,19(3):593-596. 被引量:13
  • 2Erbe A,Weiss C,Zwerger W,et al.Nanomechanical Resonator Shuttling Single Electrons at Radio Frequencies[J].Physical Review Letters,13 August 2001,87(9):096-106.
  • 3Li X,Ono T,Wang Y,et al.Study on Ultra-Thin MEMS Cantilevers-High Yield Fabrication and Size-Effect on Young's Modulus of Silicon[J].IEEE,2002:427-430.
  • 4Cleland A N,Pophiristic M and Ferguson I.Single-Crystal Aluminum Nitride Nanomechanical Resonators[J].Applied Physics Letters,2001,79(13):2070-2072.
  • 5Namatsu H,Nagase M,Kurihara K,Iwadate K,Murase K.10-nm Silicon Lines Fabricated in (110) Silicon[J].Microelectronic Engineering,1995,27:71-74.
  • 6Pandraud G,Veldhuis G,Berenschot J W,et al.Micromachining of High-Contrast Optical Waveguides in <111> Silicon Wafers[J].IEEE Photonics Technology Letters,2000,12(3):308-310.
  • 7Dana Cristea,Munizer Purica,Elena Manea,et al.Experiments for Microphotonic Components Fabrication Using Si <111> Etching Techniques[J].Sensors and Actuators,2002,A90:92-97.
  • 8Cleland A N and Roukes M L.Fabrication of High Frequency Nanometer Scale Mechanical Resonators from Bulk Si Crystals[J].Appl Phys Lett,Oct.1996,69(18):2653-2655.

共引文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部