镍钨合金电镀工艺的初步研究

Preliminary study of nickel-tungsten alloy plating process

研究了镀液组成和电镀条件对镀层中钨含量和电流效率的影响。确定的最佳工艺配方为:Ni2+13.5g/L,Na2WO4·2H2O50g/L,配位剂75g/L,温度60°C,电流密度3A/dm2。在此条件下获得了钨含量为40%～45%(质量分数)的镀层,电流效率为38%。镀层经400°C热处理2.5h后,硬度可达1100HV。

The effects of bath composition and process conditions on tungsten content and current efficiency of a nickel-tungsten alloy electroplating process were studied. The optimal process parameters were determined as follows： Ni^2＋ 13.5 g/L, Na2WO4·2H2O 50 g/L, complexing agent 75 g/L, temperature 60 ℃ and current density 3 A/dm^2. Under the above conditions, the process produces a deposit containing 40%-45% （mass fraction） tungsten with a current efficiency of 38%. The hardness of deposit was 1 100 HV after heat treatment at 400 ℃ for 2.5 h.