摘要
通过锡须指数的计算及对高低温循环实验条件下锡须生长情况的观察与测量,建立了锡须指数与锡须生长长度之间的关系,使得可以在高低温实验结果出来之前就能借助锡须指数来评估锡须生长的风险,从而使实时评估控制镀锡电镀生产线变为可能。
Based on the calculation of Tin whisker index and the observation and measurement of the Tin whisker growth at the temperature cycling environment, a relationship between Tin whisker index and the length of Tin whisker was established. With the aid of Tin whisker index, the risk of whisker growth on pure tin coating can be evaluated before the results of trational, time consuming temperature cycle experiment is obtained. Therefore, it becomes possible that the plating line can be monitored at real time for Tin whisker growth risk control.
出处
《电镀与精饰》
CAS
北大核心
2010年第4期5-7,10,共4页
Plating & Finishing
关键词
纯锡电镀
锡须
锡须指数
物相分析
pure tin plating
tin whisker
tin whisker index
phase analysis
