摘要
通过X-射线衍射分析、场发射扫描电子显微镜分析、表面原子力显微镜分析及透射电子显微镜观察,得到了电刷镀纳米晶铜镀层为等轴晶粒结构,晶粒d平均为26nm,且分布均匀,主要为大角度晶界结构,不存在微观裂纹、微孔及明显的晶体织构。
The electric brush plating Nano-copper films were researched by means of XRD, SEM, AFM, TEM. The results show that they were in equality axis crystal with average grain size of 26 nm and large- angle crystal boundary,without evident crystal texture and microcrack and pinhole.
出处
《电镀与精饰》
CAS
北大核心
2010年第4期8-10,共3页
Plating & Finishing
关键词
电刷镀
纳米晶
铜镀层
微观结构
electric brush plating
nano-crystal
copper coating
microstructure
