期刊文献+

一种用于化学机械抛光的加压装置设计研究 被引量:3

Research and Design on a Device to Apply Down-force in Chemical Mechanical Polishing Process
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摘要 low-k材料的使用,使低下压力技术成为化学机械抛光(CMP)设备研发设计必须面临的关键技术之一,为适应该需求,提出了弹性组合元件加压技术,即通过改变加压元件的变形量来实现压力调整的机械调压技术。对该加压模式的设计要求及加压精度进行了理论分析,并进行了加压精度及压力-变形线性关系的实验验证。实验所得的加压精度与理论分析结果比较接近,加压装置的压力与变形之间基本呈线性关系。加压元件可以实现压力从零开始的低下压力、高精度压力调整。 With the use of low--k material, low down--force CMP has been a crucial technology for the equipment design. The technology of elastic compound elements was promoted to meet the needs of the low down--force. The assembly of the elastic element applied down--force in mechanical model. And down--force on the wafer was controlled by deformation of the pressure element. Re- quirements and the accuracy of pressure element were analyzed in theory, and the experimental results tallies basically with it. Also the down--force was in linear to the deformation of it. The pressure ele- ment can be regulated from zero in high precision under the low down force.
出处 《中国机械工程》 EI CAS CSCD 北大核心 2010年第7期839-842,864,共5页 China Mechanical Engineering
基金 国家自然科学基金资助项目(50390061)
关键词 化学机械抛光 低下压力 弹性组合元件 加压元件 chemical mechanical polishing(CMP) low down-force assembly of elastic element pressure element
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参考文献12

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