摘要
利用ANSYS有限元分析方法,从适配层的引入对W/Cu面对等离子体部件界面热应力降低以及表面温度影响等角度来进行适配层的选择和优化研究。分析结果显示:NiCrAl、Ti和W/Cu适配层均能有效降低界面最大热应力,其中W/Cu适配层使其降幅高达23%;W/Cu适配层的应用对等离子体部件温度分布影响较小;对于1mm钨涂层,0.1mm、25vol%W/Cu是最优化适配层结构。
Choice and optimization of compliant layer between W/Cu plasma facing components were carried out by means of ANSYS finite element analysis from the angles of the stress in the interface alleviating and the effect of surface temperature. The results show that the compliant layer （NiCrAl,Ti and W/Cu） can effectively alleviates stress concentration compared with the sharp interface,especially W/Cu compliant layer,which results in the maximum stress reduction of 23%. And the application of employ of compliant layer induces surface temperature to increase slightly. Further analysis indicates that for 1mm W coating,25vol%W/Cu with the thickness of 0.1 mm is the optimum compliant layers,which result in the smallest peak stress.
出处
《热加工工艺》
CSCD
北大核心
2010年第6期17-20,共4页
Hot Working Technology
基金
徐州工程学院青年科研基金资助项目(XKY2008106)
关键词
钨
面对等离子体部件
有限元分析
tungsten
plasma facing component
finite element analysis
