摘要
研究了碘化钾(KI)对LC4铝合金表面化学镀Ni-P合金层沉积速度的影响,采用金相显微镜、显微硬度计和交流阻抗等方法考察了碘化钾对Ni-P镀层形貌、显微硬度以及耐蚀性的影响。结果表明:KI使Ni-P合金镀层的沉积速度有所降低,使镀层表面缺陷数量减少,镀层致密性提高。随着镀液中KI含量的增加,镀层显微硬度逐渐降低,但都高于镀液中无KI时所得镀层的硬度。此外,KI也改善了镀层在w(NaCl)=3.5%溶液中的耐蚀性。镀液中KI的适宜含量为10～20mg/L。
The effect of KI on the deposition velocity of Ni-P electroless plating coating for LC4 aluminium alloy was investigated,and the surface micrograph was observed using OM,and the surface micro-hardness and corrosion resistance of Ni-P coating were tested by micro-vicker and electrochemical impedance spectroscopy （EIS）,respectively. The results show that KI decreases the deposition velocity and defects of Ni-P films,and the Ni-P surface morphology gets more homogenous,which contributes to higher micro-hardness and better corrosion resistance in 3.5wt% NaCl solution. The reasonable concentration of KI in the bath is 10～20 mg/L.
出处
《热加工工艺》
CSCD
北大核心
2010年第6期94-96,104,共4页
Hot Working Technology
关键词
铝合金
化学镀
碘化钾
显微硬度
耐蚀性
Al alloy
electroless plating
KI
micro-hardness
corrosion resistance
