链板失效分析

Failure Analysis of Chain Plate

借助硬度计、直读光谱仪、金相显微镜对失效链板进行检测和分析。结果表明:链板原材料中存在条状夹杂物和带状组织,链板冲压成形时产生了表面裂纹,已有的裂纹在随后的淬火处理时产生的应力作用下,沿着夹杂物和带状组织提供的应力"通道"扩展,最终导致链板发生突然断裂。

Analysis of chain plate failure was performed by using sclerometer,spectrum analyzer and metallurgical microscope. The results show that the surface cracks produce during the formation process of chain plate stamping due to the existence of strip inclusions and banded structures in the raw material; these cracks,under the stresses arising from the subsequent quenching process of the chain plate,propagates through the stress ＂channel＂ provided by the stripe shaped impurities and the banded structures; the crack propagation eventually leads to the sudden fracture of the chain plate.