基于电子背散射衍射(EBSD)技术的材料微区应力应变状态研究综述

Micro-stress-strain analysis in materials based upon EBSD technique:a review

材料中微米级微区范围内的应力和应变状态常被用来解释宏观材料的失效行为。目前的常规技术都难以实现数微米范围内的应力应变测试和分析。电子背散射衍射(EBSD)技术是近年来新发展的可用于微区应力应变状态分析的有力手段。它是扫描电镜(SEM)的附件之一,具有较高的空间分辨率、角度分辨率和应变敏感性。本文以材料形变方式为基础,综述了EBSD技术对弹性应变和塑性应变的不同表征原理与方法。同时,还介绍了应变敏感度的提高和进展,及测量参数对结果精度的影响,为更好地发展该应用提供理论指导。

The constitutive relationship in a micrometer scale in materials is generally used for analyzing failure behavior of materials in macro scale. However,it is impossible to ditermine it using traditional techniques.In recent decade,it has been known that the electron backscatter diffraction（EBSD） technique is a powerful tool for analyzing the local strains in materials.It is an accessory attached to a scanning electron microscope（SEM）.It has advantages upon the micro stress-strain analysis with high space resolution,high angular resolution and high strain sensitivity.In this paper,the measuring of principles and methods for both the elastic strain and plastic strain using EBSD are reviewed.The main problems that should be solved in the future are also discussed.