Cooling Behavior in a Novel Heat Sink Based on Multilayer Staggered Honeycomb Structure
Cooling Behavior in a Novel Heat Sink Based on Multilayer Staggered Honeycomb Structure
摘要
A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cell microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inlets and outlets heatsink design, experimental results showed that more uniform substrate temperature distribution was obtained than the single inlet and outlet ones. It showed that the heatsink design provided a good choice for electronic chips cooling applications.
参考文献11
-
1D.B. Tuckerman. R.F.W. Pease, High Performance heat sink for VLSI, IEEE Electron Device Letters EDL-2 (5) (1981) 126-129.
-
2S.V. Garimella, C.B. Sobhan, Transport in micro channels-A critical review, Annual Reviews of Heat Transfer 13 (2003) 1-50.
-
3T. Kishimoto, S. Sasaki, Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices, IEEE Electron. Letters 23 (9) (1987) 456-457.
-
4Y.P. Chen, P. Cheng, Heat transfer and pressure drop in fractal tree-like microchannef nets, Int. J. Heat Mass Transfer 45 (13) (2002) 2643-2648.
-
5X.Q. Wang, A.S. Mujumdar, C. Yap, Thermal characteristics of tree-shaped microchannel nets for cooling of a rectangular heat sink, Int. J. Thermal Sciences 45 (2006) 1103-1112.
-
6K, Vafai, L. Zhu, Analysis of two-layered microchannel heat sink concept in electronic cooling, Int. J. Heat Mass Transfer 42 (1999) 2287-2297.
-
7X.J. Wei, Y. Joshi., Stacked microchannel heat sinks for liquid cooling of microelectronic components, J. Electronic Packaging 126 (1) (2004) 60-67.
-
8X.J. Wei, Y. Joshi, Optimization study of stacked micro-channel heat sinks for micro-electronic cooling, IEEE Trans. on Components and Packaging Technologies 26 (1) (2003) 55-61.
-
9X.J. Wei, Y. Joshi, M.K. Patterson, Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices, J. Heat Transfer 129 (10) (2007) 1432-1444.
-
10X.B. Luo, Y.L. Liu, W. Liu, A honeycomb micro channel cooling system for electronics cooling, in: Proceedings of the ASME 7th International Conference on Nanochannels, Microchannels and Minichannels, June 22-24, 2009, Pohang, South Korea.
-
1能跑更远 The new BMW i3 94Ah[J].汽车知识,2016,0(6):15-15.
-
2张雪平,赵广超.未来轰炸机热管理系统方案及关键技术浅析[J].制冷与空调（四川）,2011,25(6):629-632. 被引量：1
-
3赵宁.LED照明的杂散光分析与散热研究[J].中国测试,2013,39(6):32-35. 被引量：4
-
4郑建霞.一种具有过流过热保护功能的大电流开关(英文)[J].广州大学学报（自然科学版）,2003,2(3):249-251. 被引量：1
-
5辐射源、光源[J].中国光学,1997(5):7-7.
-
6罗鹏程,齐龙.热沉技术在高低温低气压试验箱中的应用[J].环境技术,2014,32(2):58-60.
-
7Limei CAO,Xinhui SI,Liancun ZHENG.Convection of Maxwell fluid over stretching porous surface with heat source/sink in presence of nanoparticles:Lie group analysis[J].Applied Mathematics and Mechanics(English Edition),2016,37(4):433-442. 被引量：1
-
8俞云平.浅谈LED路灯的户外持久防护[J].中国照明,2009(5):88-88.
-
9王志恒,万敏,李小将.电磁轨道炮接触热时空分布特性分析[J].高压物理学报,2016,30(6):511-516. 被引量：10
-
10陈炳儒,胡鸿烈.照亮前方—LED汽车头灯的技术要点[J].电子产品世界,2006,13(10S):36-36.
