摘要
研究了固溶温度、时效温度和时间对ITER级Cu-0.8Cr-0.1Zr合金强化规律的影响和不同工艺下的金相组织,分析了合金导电率随时效温度的变化规律。结果表明:Cu-0.8Cr-0.1Zr合金硬度均随固溶温度、时效温度和时间的增加而呈现出峰值。在950℃固溶、480℃时效3h后获得最佳硬化效果,硬度值为138HV0.2。合金经固溶处理后的相对导电率仅为34%IACS,随时效温度的升高,导电率增加,480℃时效处理3h,导电率达最大值74%IACS。
The effects of solution temperature, aging temperature and aging time on the strengthening change rule of ITER-grade Cu-0.8Cr-0.1Zr alloy were studied. The microstructure of copper alloy under different heat treatment was analysed. And the change rule of electrical conductivity with the increase of aging temperature was also analysed. The results show that the peak value of hardness is obtained with the increase of solution temperature, aging temperature and aging time. After solution at 950 ℃ and aging at 480 ℃ for 3 h, the best hardness reaches 138 HV0.2. The electricity conductivity of Cu-0.8Cr-0.1Zr alloy is 34% after solution at 950 ℃, then increases with the increase of aging temperature. After aging at 480 ℃ for 3 h, the highest electrical conductivity is 74%.
出处
《热加工工艺》
CSCD
北大核心
2010年第8期149-151,共3页
Hot Working Technology
基金
国际热核聚变实验堆(ZTER)计划专项(2008GB105000)
