高速互连设计中耦合微带线间的串扰分析

Analysis of Crosstalk between Coupled Microstrips for Design of High Speed Interconnects

在高速互连设计电路中,耦合微带线间的串扰是影响电路性能和稳定性的主要因素.为了降低线间串扰,添加有接地过孔的防护线对减小串扰起到了很好的作用.在维持3条线(防护线和两条微带线)中两两之间的中心距不变的情况下,加大防护线的宽度,可有效减小线间的远端和近端串扰.利用FDTD方法对该结构进行模拟,给出了接地孔的有效放置方法.

In the design of high speed interconnects curcuit,crosstalk between coupled microstrips is the key factor to affect the performance and the stability of the circuit. To reduce the crosstalk between microstrips, inserting the guard trace with several grounded vais is good at reducing crosstalk. By obeying the smallest side to side distance routing rule and keeping the center to center distances between arbitrary two of three lines （microstrips and the guard trace）constant, the guard trace inserted should be as wide as possible. In this paper, the method of FDTD is used to simulate the structure, finally, the effective method of placement is presented for grounded vais.