放电等离子烧结制备高导热SiC_P/Al电子封装材料

High thermal conductivity SiC_P/Al electronic packaging materials prepared by spark plasma sintering

为了满足电子封装材料越来越高的性能要求,采用放电等离子烧结(SPS)工艺制备了SiCP/Al复合材料。研究了烧结温度和保温时间等工艺条件对SiCP/Al复合材料组织形貌和性能的影响。结果表明:采用SPS烧结,温度为700℃、保温时间为5 min时,所制备的70 vol%SiCP/Al复合材料热导率达到195.5 W(m.K)-1,与传统15%W-Cu合金相当,是Kovar合金的10倍,但密度小,仅为3.0 g.cm-3;其热膨胀系数为6.8×10-6K-1,与基板材料热膨胀系数接近;抗弯强度为410 MPa,抗拉强度为190 MPa,达到了电子封装材料对热学性能和力学性能的要求。

The high thermal conductivity SiCP/Al electronic packaging materials were successfully prepared by the spark plasma sintering（SPS） process.The effects of sintering temperature and holding time on the microstructure of SiCP/Al composites were researched.And thermo-physical characteristics of final composites were also evaluated.The results show that the thermal conductivity of 70 vol%SiCP/Al composites fabricated by SPS is 195.5 W·（m·K）-1,which corresponds to that of 15%W-Cu and decuples that of Kovar alloy;the density is 3.0 g·cm-3;the thermal expansion coefficient（CTE） is 6.8×10-6 K-1,which is close to the substrate materials;and the bend strength is 410 MPa,tensile strength is 190 MPa,satisfying the electronic packaging materials needs in thermal and mechanics properties.