低成本常温固化、高温使用环氧树脂胶粘剂的研制

Preparation of low-cost heat-resistant epoxy resin adhesive cured at room temperature

以E44环氧树脂为基料，加入固化剂HD、增强剂、填料等，制备出可在室温下2—3h固化，使用温度达到200℃的胶粘剂体系。适用于钢铁、铝合金及磨料等工件的粘结。成本远低于市场同类产品。

Using E-44 epoxy resin as the base material, by adding curing agent HD, enhancers, fillers, etc. The adhesive system can be prepared at room temperature for 2 -3 h curing, and the using temperature is 200 ℃. It can be applied to steel, aluminum, and bonded abrasives such as the work-piece. The cost is far lower than the market similar products.