电解铜箔中异常粒子成长的解析

Analysis of Abnormal Grain Growth in Electrolytic Copper Foil

研究了电解铜箔制造时旨在防止缺陷的镀铜层上发生的异常粒子成长。在Ti基板上形成镀铜层,应用配备有能量耗散X-线分光计的电子扫描显微镜(SEM-EDX)和X-线衍射观察异常粒子析出。异常粒子的发生取决于Ti基材预处理方法。预处理加工时机械抛光发生的Ti粒子与异常粒子成长有关。Ti粒子附近的铜的取向不同于其它部分的镀层。因此Ti粒子与异常粒子成长有关。

Abnormal grain growth occurring on an electrodeposited copper film was investigated for defect prevention during electrolytic copper foil production. Anelectrodeposited copper film was formed on a titanum substrate. Then abnormal grain growth was observed using scanning electron microscope equipped with an energy dispersive x-ray spectrometer（SEM-EDX） and x-ray diffraction（XRD）. Generation of abnormal grains depended on the method of pretreatment of the titanium substrate. Titanium particles generated by mechanical polishing during the pretreatment process were related to the abnormal grain growth. The preferred orientation of copper near titanium particles differed from that in the other parts of the film. Therefore, titanium particles were found to be involved in abnormal grain growth.