串接石墨化炉中产品出现“麻面”的原因和解决方法

Cause and solutions of pockmarks on product surface in LWG process

在串接石墨化炉中产品会产生"麻面",严重地会影响制品销售和使用。本文从生产实践出发,阐述产生"麻面"的原因及形成机理,并提出解决的方法。通过生产实践,最终彻底解决"麻面"问题。

The pockmarks on product surface in LWG process will have a harmful influence on electrode use and sale. The causes of pockmarks of the products were discussed from production practice, and solutions were proposed, which will be hopeful for the practical manufacture of the products without pockmarks in LWG process.