金属/陶瓷钎焊系统反应润湿及界面结构的研究现状

Research progress on Reactive Wetting and Interfacial Structure of Metal-Ceramic Soldering Systems

陶瓷与金属连接起来,可以使两者性能互补,发挥综合优势,目前陶瓷与金属钎焊已是工程领域研究的热点.为此,对金属/陶瓷的反应润湿机制和不同金属钎料在氧化性和非氧化性陶瓷上反应润湿和界面情况的研究现状进行了综述与分析.

To connect the metal with the ceramic can make the performance of both materials supplemen- tary, displaying comprehensive superiority. At present it is a focus to study metal-ceramic soldering in materials engineering. This article is devoted to clarifying the mechanism of reactive wetting in metal-ceramic systems and summarizing research progress about reactive wetting and interfacial condition of different metal solder on oxidized ceramics and non-oxidized ceramics.