摘要
以一款MR16 LED射灯为模型,采用ANSYS有限元软件进行热分析。以散热器翅片保持60℃为标准,通过实验与仿真相结合的方法,分析了LED射灯的热流功率、散热器基座厚度、LED芯片间距、对流面积对整个系统散热性能的影响。结果表明,散热器对流面积是影响灯具散热性能的最重要因素;对一定的散热器,存在一个有效的最大芯片输入功率。现有MR16 LED射灯的散热器最大散热功率只能达到2.5 W左右,要使散热功率增大并且发挥散热器最佳性能,必须增加散热器的对流面积。对该结构散热器散热性能的定量研究对今后高功率LED灯具的生产具有一定的指导意义。
With MR16 LED spot lamp as a model,thermal analysis is carried out by finite element of software ANSYS.Keeping heat sink fins 60 ℃ as standard,all components of the spot lamp which effected on thermal performance of entire system are analyzed concluding convection coefficient by experiment and simulation.The results show that convection area of heat sink is the most important factor influence on the thermal performance of lighting system.For a certain heat sink,there exists an effective highest input power of maximum chip.The existing heat sink of MR16 LED spot lamp can only achieve the maximum thermal power about 2.5 W,as for thermal power increasing,it needs to increase the convention area of heat sink.The quantitative study on the structure of heat sink will be certain significance for the future production of high-power LED lamps.
出处
《半导体技术》
CAS
CSCD
北大核心
2010年第5期443-446,共4页
Semiconductor Technology
基金
浙江省科技计划资助项目(2008C21158)
浙江省研究生教育创新示范基地支持项目(YJ2008023)
