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硅黄铜耐磨性能研究 被引量:4

Wear Resistance of Silicon Brass
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摘要 以硅黄铜60Cu-Zn-Si为研究对象,研究了其在200、400、600、800℃热处理后的耐磨性能,并对合金进行了显微组织分析。结果表明,随着热处理温度的增加,60Cu-Zn-Si合金磨损量先降低后增加。经400℃固溶处理后的试样磨损量最小,耐磨性最好。显微组织分析表明,400℃处理后60Cu-Zn-Si合金的显微组织均匀,晶粒细小,并有均匀细小的弥散强化质点分布在基体组织中。 Wear resistance and microstructure of self-melting silicon brass 60Cu-Zn-Si alloy with heat treatment at 200, 400, 600, 800℃, respectively, for 1 hour and quenching in water, were analyzed. It is found that with increasing in temperature, wear weight loss of 60Cu-Zn-Si alloy is firstly decreased and then increased. The lowest weight loss of the alloy can be observed after solid solution treatment at 400 ℃, showing desirable wear resistance. In addition, microstructural observation shows that 60Cu-Zn-Si alloy after solid solution treatment at 400 ℃ exhibits uniform structure with fine grain size, in which fine disperoids is uniformly distributed.
作者 周世杰
出处 《特种铸造及有色合金》 CAS CSCD 北大核心 2010年第4期380-381,292,共2页 Special Casting & Nonferrous Alloys
关键词 硅黄铜 耐磨性 显微组织 Silicon Brass, Wear Resistance, Microstructure
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