高速电路中三维互连结构频变电感参数的提取

Extraction of Frequency Dependent Inductance of 3 D Interconnects in High Speed Circuits

高速集成电路系统中互连线和封装结构的等效电感对系统电性能有十分重要的影响．文中提出了用一种简单模型计算随频率变化的电感．该模型将导体横截面划分成若干分块以考虑在不同频率下电流的不均匀分布，利用在电流均匀分布情况下自感和互感的计算结果，避免了在计算离散方程稀疏矩阵时的多重数值积分，简化计算过程简化．利用本方法计算单导体和双耦合导体频变电感。

The effective inductance of interconnects and packaging structures in high speed IC system has essential influence on system electrical performance. For 3D inductance calculation, the concept of partial inductance must be utilized. A simple model for computing the freguency dependent inductance was delivered, the cross section of the conductors was divided into several subsections for considering the nonuniform current distribution under the different frequencies. Besides, it employed the computing results of the self and mutual inductances under uniform current distribution to avoid the multiple numerical integration in calculation of sparse matrix of the discrete equation. The computing results of the frequency dependent inductance for single conductor line and coupled two conductor lines by this method were given.