摘要
介绍了新型ＣＭＯＳ－ＳＥＥＤ灵巧象素结构原理及相关的倒装焊技术，采用厚光致抗蚀剂作掩模，通过磁控溅射和真空蒸发相结合，解决了与ＣＭＯＳ－ＳＥＥＤ有关的Ｉｎ凸点阵列成型等关键工艺，并用Ｍ８－Ａ型可视对准式倒装焊系统完成了ＣＭＯＳ电路芯片和ＳＥＥＤ阵列芯片的倒装焊。
The structure of CMOS SEED smart pixels and the related flip chip bond technique were introduced.Using thick photo resist as a mask,indium solder bump array was manufactured through magnetic sputtering and vacuum vaporing method.As a result,the CMOS IC chip and SEED array chip were flip bonded by a M8 A visible align flip chip bonder system.
出处
《半导体情报》
1999年第1期37-40,共4页
Semiconductor Information
