多芯片组件倒装焊焊点三维形态预测研究

Study on Flip-Chip 3-D Shape Prediction of MCM

基于最小能量原理建立了多芯片组件（ＭＣＭ）倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。通过对预测结果进行数据分析与处理，建立了钎料体积和预定间隙与焊点高度之间的预测关系表达式。

Based on minimal energy principle,Evolving model of flip-chip 3-D shape prediction of MCM is established,and 3-D solder shape is effectively predicted.After that,the relationship between the process parameters(solder volume,gap height)and the solder height is established through data analysis and process.