摘要
研究了ＳＦ６型高压断路器用陶瓷电容器的电极与引线之间的焊接技术，采用６２Ｓｎ／３６Ｐｂ／２Ａｇ锡膏及相应的工艺措施，解决了以前用锡箔片焊接存在的工艺难控制、易堆锡、银溶问题以及用环氧树脂银导电胶粘接存在的导电胶老化问题，获得了工艺简单且使焊接强度明显提高的焊接方法。
Soldering thechnique between leads and electrodes of ceramic capacitor is researched,by using 62Sn/36Pb/2Ag solder cream and relative process.Problems arised from solder foil, siliver solution,solder accumulation,difficut control,and aging problem of using conductive epoxy resin glue are solved.A simply method of soldering is acquired,which has high soldering strength result.
出处
《电子工艺技术》
1999年第2期58-60,共3页
Electronics Process Technology
