摘要
论述了晶片键合技术的发展概况、基本原理和基本方法，并对键合晶片的表征技术作了介绍。最后着重介绍了晶片键合技术在微电子学领域中的应用。
Great progress has been made in wafer bonding technology for the last decade,and the applications of the technology has become widespread.In this paper,the principle of wafer bonding is described and different approaches of the technology are dealt with.Also,the characterization of wafer bonding is discussed.Furthermore,specific introduction is given to the applications of wafer bonding technology in microelectronics.
出处
《微电子学》
CAS
CSCD
北大核心
1999年第1期44-49,共6页
Microelectronics
