铸铁基体次亚磷酸钠化学镀铜

Electroless copper plating using sodium hypophosphite on cast iron

研究了镀液组成、pH值、镀铜温度、时间、体积等因素对镀铜效果的影响,确立了以硫酸铜为主原料、次亚磷酸钠为还原剂、乙二胺四乙酸二钠和柠檬酸钠为混合络合剂为主要镀液组成的碱性还原镀铜体系.并成功地在铸铁基体上实现了铜的连续自催化沉积,获得了较光亮红黄色的铜镀层.该镀层与传统氰化镀铜相比,结合力相当,亮度更好,光洁度达花8级.

The effect of plating bath in composition,pH ,temperature,time and volume on the electroless plated copper was studied. An alkaline electroless copper plating bath including copper sulfate as main salt,sodium hypophosphite as reducing agent,EDTA and sodium citrate as blending chelating agent,was established. A continuous self-catalyzed deposition of bright red-yellow copper coating on cast iron substrate was obtained successfully. Compared with traditional electro plated copper from cyanide-based plating,the electroless copper plating has a similar performence in the combination face to the substrate,better in brightness,and surface roughness of the electroless copper plating arrived at 8.