摘要
研究了镀铑液组成浓度和Ａｕ－Ｒｈ配套镀工艺参量对龟裂的影响规律。结果表 明在一定范围，随镀铑液浓度降低，可获得晶粒细小致密又无龟裂的优良Ａｕ－Ｒｈ配套镀层。 而工艺参量中，镀厚金时间、镀铑的阴极电流密度和镀铑时间对镀层龟裂的产生也有一定影 响。通过工艺参量的合理取值，可以抑制龟裂的萌生和扩展。
The influence of electrolyte concentrations for rhodium plating and process paramters on the tor- toise crack developed within the gold - rhodium electrodeposit. It has shown that better Au - Rh electrode - posite with the fine - grain microstructure as well as free - tortoise crack could be obtained by decreasing the concentrations of Rh electrolyte in certain region, On the other hand, the time of gold plating and cathodic current density and the time of Rh plating also have an obvious effect on crack development. However, if the electrodepositing parameters were conducted at correct values, the tortoise crack would be prevented from the electrodeposited gold - rhodium .
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
1999年第1期30-33,40,共5页
Ordnance Material Science and Engineering
关键词
镀层
龟裂
电沉积
金
铑
电镀
electrodeposited gold- rhodium, torioise crack. electrodepositing stress
