摘要
以具有微结构的塑件——微流控芯片为研究对象,利用单因素试验方法研究注射工艺参数对微结构复制不完全和表面缩痕这两种主要成型缺陷的影响并加以分析。结果表明,注射速度和模具温度是影响微结构复制不完全的主要因素,注射压力起次要作用,保压压力影响不明显;影响芯片表面缩痕的主要因素是模具温度和保压压力;保压时间对微结构填充度的影响很小,但却是芯片整体翘曲变形的主要原因。
With the micro-structure of the plastic part（microfluidic chip） as an object of study,using the single-factor test method,the influence of different process parameters on the incomplete duplication of microstructure and sink mark for microstructure plastic parts was discussed. The results show that injection rate and mold temperature are the principal factors in the incomplete duplication,injection pressure is the secondary factor and holding pressure is inapparent. Mold temperature and holding pressure are two main influence factors on sink mark. Holding time has a negligible effect on the incomplete duplication,but it is the main reason for the warpage deformation.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2010年第5期104-107,共4页
Polymer Materials Science & Engineering
基金
"十一五"国家科技支撑计划重点项目(2006BAF04B13)
关键词
微流控芯片
微结构塑件
复制
缩痕
成型缺陷
microfluidic chip
microstructure plastic part
duplication
sink mark
molding defects
