焊膏质量对无铅微组装焊点可靠性的影响

Impact of Solder Paste Quality on Reliability of Solder Joint In Lead-free Micro-assembly

元器件的微型化和产品的多功能化,驱动了产品安装设计的高密度化和立体化,导致了微组装技术时代的到来。其特点是焊点愈来愈密集;焊点尺寸愈来愈微小;间距愈来愈细。在分析了微小型元器件的发展特点及其所带来的工艺问题的基础上,列举了无铅微焊点常见的品质缺陷。探讨了无铅微组装焊点的可靠性对焊膏应用性能的要求。通过严格的可靠性试验,对比性地列举了国产无铅焊膏与国外知名品牌间的性能差异。

With component micromation and product multifunction, the product design three -dimensional assembly and integration, the micro - assembly technology age is coming. It is of the characteristics of high integration and small size and fine pitch more and more. List soldering defects of common lead - free solder joint based on the analysis of small size developing and leading to assembly process problem. Discuss the requirement of applied performance of solder paste on lead - free assembly joint reliability. With reliability experiment, the difference of solder pastes is listed between made in inside the country and outside the country.