摘要
介绍了压焊机为适用微组装电子元器件领域的应用而进行的功能设计,微组装电子元器件领域的工艺概况,压焊机的主要结构、工作过程、关键技术,分析了共晶压力对焊接效果的影响。
The press welder is introduces in this paper. It is designed in order to the application in micropackage electric parts field. The main structure, work process and key technique of the press welder is introduced. In addition, the weld result impact of the eutectic force is mentioned.
出处
《电子工业专用设备》
2010年第5期20-21,33,共3页
Equipment for Electronic Products Manufacturing
关键词
微组装
共晶
压力
温度
Micropackage
Eutectic
Force
Temperature
